MEMS forms ultraminiature, high precision and high performance 3D structure by fully using microfabricating technology of semiconductors. It attracts attention as an upcoming technology from a wide variety of fields. We are able to give a consistent support to production that uses MEMS, from design and simulation to pre-production. As an example of past operations, we have results in TSV（Through Silicon Via：Si penetrating electrode） and rewiring technology. We are able to deal with various substrates such as Si and ceramics. As MEMS can integrate several functions, we will improve our technology to utilize it for production of more value-added products.
Spin coater, Spray coater, Double sided aligner, Developing device, Wet etching equipment, RIE system, ICP-RIE system, Ashing device, Sputtering equipment, TEOS-CVD system, Thermal oxidation furnace, Laser dicing system, Blade system