Lapping / Polishing

	We are able to stably supply ultra-thin, high precision double sided lapping and polishing brittle wafers, focusing on crystal. In lapping process, the both sides of a wafer are polished simultaneously between upper and lower surface plates. It realizes high removal efficiency and processing accuracy. In polishing process, abrasive cloths are attached on surfaces of upper and lower surface plates and polish the both sides of the wafer simultaneously with finer abrasive grain to finish up to an extremely smooth mirror surface.

We are able to stably supply ultra-thin, high precision double sided lapping and polishing brittle wafers, focusing on crystal. In lapping process, the both sides of a wafer are polished simultaneously between upper and lower surface plates. It realizes high removal efficiency and processing accuracy. In polishing process, abrasive cloths are attached on surfaces of upper and lower surface plates and polish the both sides of the wafer simultaneously with finer abrasive grain to finish up to an extremely smooth mirror surface.

Technology Division, Ministry of Hatai Tadashi crystal (left) and Takemura Kouzi (right)

Processing other materials besides crystal in the future is our aim.

Since we deal with ultra thin products such as 20 to 30 micron thick, we always work with the greatest care. Our advantage is double sided ultra thin lapping and polishing of large-sized wafer. Also as for brittle materials besides crystal, we already have experiences with processing optical glass and ceramics, so much more is gained for our technologies and know-how by dealing with other materials in the future.: Sadaaki Hatai(left) Koji Takemura(right), Crystal Devices Division

Fundamental technology

Double sided lapping & polishing of thin brittle materials
High precision process (reducing thickness variability)

Facilities in our factory


Double sided lapping / polishing	Single sided lapping / polishing

Capability

Crystal Wafer

Surface finish	Wafer size	Thickness	Tolerance	Cut angle
Lapping finish	15mm~ 20mm~	0.020mm~ 0.030mm~	±0.001mm~ ±0.001mm~	AT&Z cut, etc.
Mirror finish	15mm~ 25mm~ Φ4inch~	0.030mm~ 0.043mm~ 0.060mm~	±0.002mm~ ±0.002mm~ ±0.003mm~	AT&Z cut

* We will response to requests from each customer.

For more details

Please refer to the below PDF file for practical examples.

Technology: Lapping / Polishing (PDF file:127KB)