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Etching

Etching

Responding to highly precise frequency adjustment and shape processing.

Etching is dissolving and shaving technology. In wet etching which utilizes chemical reactions, thickness adjustment of high precision crystal units and frequency adjustment of AT oscillators are available. Etching is rather than an indivisual technology, often used in combination with the previous process of photolithography, and and is able to conduct shape processing of highly productive tuning-fork crystal units as well as Si etching through dry etching that uses reactive gas. There are also other etching methods, including micro blast processing that shaves materials by using abrasive. They correspond to a wide variety of purposes.

Voice from engineers

Technology Division, Ministry of crystal Kureha Tadaaki

We want to make progress on commercialization of products while overcoming challenges steadily

Conventionally, crystal wafer was cut and chipped in its layer stacks, but now, due to chemical etching technology, it is available to produce high precision and stable quality products in large volume. From now on, we would like to try commercialization of various products to meet more various needs and upgrade our technologies and knowledge.
Tadaaki Kureha, Crystal Devices Division

Capability

82700±35KHz
20.1934±0.008μm

  • Ceramic Processing
  • Core technologies of Citizen Finetech Miyota
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