Cut

	To carve out wafer from rude ore of crystal with appropriate angle and thinness, wire-saw cutting technology is adopted. This is a cutting technology where fluid with abrasive grain is supplied between a material and a thin line wire that reciprocates at high speed. A narrow diameter of the wire that is 0.1～0.2mm, enables to realize high productivity and efficiency even with small shaving margin.

To carve out wafer from rude ore of crystal with appropriate angle and thinness, wire-saw cutting technology is adopted. This is a cutting technology where fluid with abrasive grain is supplied between a material and a thin line wire that reciprocates at high speed. A narrow diameter of the wire that is 0.1～0.2mm, enables to realize high productivity and efficiency even with small shaving margin.

Technology Division, Ministry of crystal Moriizumi Yoshihiko

Everyday is a challenge for higher precision cutting technology.

The key point of cutting technology is how we can cut the material accurately with stable thinness and angle. In this way, yield of material use is improved. In addition, it impacts on next process highly such as lapping if there is a variation in each lot, so we always pay close attention. To further refine the current high precision, our commitment continues everyday.: Yoshihiko Moriizumi, Crystal Devices Division

Fundamental technology

Machining conditions (Cutting speed wire supply, etc.)
Free abrasive fluid conditions (type of cutting fluid use abrasive count, etc.)
Terms used wire (wire diameter tension, etc.)

Facilities in our factory


Dicing cutter	Wire cutter

Capability

Processing materials	Crystal, glass, ceramics, various crystalline materials, etc.
Maximum workpiece size can be cut	w240mm×h150mm×d270mm
Minimum cutting thickness	0.07㎜~
Precision crystal case (Wafer size 20㎜)	･Thickness presicion (s/Wafer) 0.003㎜･Angle precision (s/batch) 12"

For more details

Please refer to the below PDF file for practical examples.

Technology: Cut (PDF file:127KB)