To carve out wafer from rude ore of crystal with appropriate angle and thinness, wire-saw cutting technology is adopted. This is a cutting technology where fluid with abrasive grain is supplied between a material and a thin line wire that reciprocates at high speed. A narrow diameter of the wire that is 0.1～0.2mm, enables to realize high productivity and efficiency even with small shaving margin.
|Dicing cutter||Wire cutter|
|Processing materials||Crystal, glass, ceramics, various crystalline materials, etc.|
|Maximum workpiece size can be cut||w240mm×h150mm×d270mm|
|Minimum cutting thickness||0.07㎜~|
|Precision crystal case
(Wafer size 20㎜)
|･Thickness presicion (s/Wafer) 0.003㎜
･Angle precision (s/batch) 12"
Please refer to the below PDF file for practical examples.
Technology: Cut (PDF file:127KB)